| Innovation in Reliability Predictions 26 June, 2007 Sheraton-Tel-Aviv, Israel |
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Tuesday, June 26 2007, 08:30 - 17:00 |
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Purpose: The seminar will provide guidance in understanding the new reliability prediction models such as: 217+, Fides, IEC and Telcordia for electronic complex systems. The prediction includes passive, active, programmable, mechanical and PCB/assemblies to achieve more accurate and realistic results. The seminar will provide knowledge and new techniques in selecting the correct prediction models for a product and the correct implementation.
General: Most of the companies which develop electronic systems invest in calculating MTBF and document the results in a report. Since there is a gap between the predictions and the field results, the usage of such results are limited only to satisfy a customer need. Investing correctly in reliability predictions will result in adding an engineering aspects in decision making in: dependencies in frequency and operating voltage with field failures, reducing number of "No Failure Found" in return PCB/assemblies, selecting components/technologies, predicting the correct number of spares needed to support the maintenance, identifying the optimal maintenance concept and additional aspects which will raise up in the seminar.
Topics: - The need for reliability prediction for new technologies
- The innovation of reliability prediction at the chip, PCB/assembly and system level
- Failure rate distribution, exponential or not?
- Stress derating models
- Passive and active components failure rate prediction models
- Programmable components models
- PCB/assemblies models
- The effect of temperature, humidity, vibration and shocks
- Integration to system
Final Agenda Registration
| 08:30 – 09:30 | The Prediction Process The new Requirements for Reliability Predictions and their effect on Maintenance Reliability innovations at the chip, PCB/assembly and system level
| 09:30 – 10:30 | Comparison between the different prediction Models - Description and Comparison between the models:217+, FIDES, IEC, and Telcordia
- Failure rate distribution, exponential or not?
- Stress de-rating models
- Reliability and the dependencies on electrical stress
| 10:30 – 11:15 | Coffee Break
| 11:15 – 11:30 | Comparison between the different Models (Continues) - Passive and active components failure rate prediction models
- Programmable components models
- PCB/assemblies models
- The effect of temperature, humidity, vibration and shocks
| 11:30 – 12:30 | Field Data Analysis - Different types of Field Failures and their Ratios
- The Stresses and temperature affecting the number of PCB’s Returns
| 12:30 – 13:00 | Lunch
| 13:00 – 14:00 | Chip Reliability Models - Frequency and Voltage influence on Chip Reliability
- Stress and Temperature Influence on Chip Reliability
- New age methods for Chip reliability Prediction
| 14:00 – 15:30 | Coffee Break
| 15:30 – 15:45 | PCB Reliability Models - Soldering, Welding and Connections Influence on PCB Reliability
- Vibration and shock Influence on PCB Reliability
- Failure rate distributions for PCB
| 15:45 – 16:30 | System Level Integration Integration of failure rates to PCB level and system level, failure rates Integration problemsA Summary and Questions | 16:30 – 17:00 |
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Gallery: One hundred Engineers participated in the Seminar. | Seminar Pictures |  |  |
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Location: TLV
Contact: PRM Symposium |
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